This page may contain stale information. Last updated: 2026-04-22
Overview
Kandou is an AI interconnect technology company that raised $225 million in Q1 2026. The company specializes in high-speed chip-to-chip communication.
Recent Developments
- Q1 2026: Raised $225M for interconnect technology
- Focus: Optical interconnects for AI data centers
Significance
Interconnect technology is critical for:
- AI cluster scaling
- High-bandwidth memory access
- Data center efficiency