Overview
Chairman and CEO of tsmc. Announced July 16, 2026 incremental 265B) for Arizona logic fabs (2nm and below) and advanced packaging, citing multi-year AI customer demand; plant timeline contingent on market situation.
Chairman and CEO of tsmc. Announced July 16, 2026 incremental 265B) for Arizona logic fabs (2nm and below) and advanced packaging, citing multi-year AI customer demand; plant timeline contingent on market situation.