Siemens and Nvidia launch self-verifying agentic AI for chip and circuit board design
Siemens today announced an expansion of its strategic partnership with Nvidia to deliver self-verifying agentic AI workflows to EDA, helping semiconductor and printed circuit board (PCB) engineering teams.
Those teams will move from autonomous task orchestration toward more trusted, continuously validated engineering outcomes. The new capabilities build on Siemens’ recently introduced Fuse EDA AI Agent system and add new Nvidia AI technology to help long-running, domain-scoped AI agents reason, act and continuously validate decisions against deterministic, physics-based EDA engines.
The Fuse EDA AI Agent system is now integrated into Siemens’ recently launched Intelligence Center X, supporting agent creation and orchestration in Siemens’ enterprise industrial AI environment.
Timothy Costa, vice president of computational engineering at Nvidia: “This closes the loop between engineering intent and real world performance. We can connect what happens during design simulation with production systems and operational data, then use that feedback to improve both the product and the process.”
Amit Gupta, chief AI strategy officer for Solido custom IC at Siemens: “Our expanded collaboration with Nvidia enhances our domain-specific industrial AI, physics-based EDA engines and accelerated computing to create trusted, self-verifying AI workflows.”
Key technical pieces cited:
- Optimized EDA agents built with Nvidia NeMo Gym open library for agentic environments
- Nvidia OpenShell secure runtime for enterprise-scale agent access controls and audit trails
- Advanced reasoning with Nvidia Nemotron models and Switchyard
- Nvidia accelerated computing and CUDA-X libraries for signoff-quality results in hours instead of days
- Solido Characterization Suite agentic workflows: >10× characterization turnaround reduction; 5×–10× token cost reduction
- New Solido Layout Analyzer with natural-language prompting for parasitic/layout-dependent effects
- Questa One Agentic Toolkit extended with Nemotron 3 Ultra; in ACE-RTL agentic RTL benchmarking, Nemotron 3 Ultra leads among open models
Coverage spans Catapult, Questa One, Veloce, Solido, Aprisa, Calibre, Tessent, Innovator3D IC, and Xpedition PCB.
STMicroelectronics Non-Volatile Memory Design manager Gianbattista Lo Giudice said Solido Layout Analyzer could cut weeks of debugging by relating layout insight to electrical behavior earlier.
Siemens’ expanded AI-driven EDA capabilities will be available in forthcoming releases of Siemens’ AI-native EDA portfolio.