NIST/Commerce (Jul 16, 2026): Official U.S. government announcement.
- Incremental 265B
- Four additional advanced semiconductor manufacturing/packaging facilities → 12 facilities total
- Follows March 2025 +65B commitment
- Tied to Jan 2026 U.S.–Taiwan trade/investment deal
- Quotes: Commerce Sec. Howard Lutnick; TSMC Chairman/CEO C.C. Wei on multi-year customer demand and U.S. ecosystem